When mounting chip components, care must be taken not to overheat them. As shown above, first tin the pads on the PC board where the component is to be mounted. In the case of chip semiconductors, use a properly grounded soldering iron and use normal CMOS handling precautions. Small tools such as tweezers, a magnifier, and dental picks are helpful. Also, if possible, use small diameter solder and a liquid flux, or solder paste if available.
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